Thermal Epoxy Heat Sink

Henkel thermal adhesives create a mechanical attachment of a component to a heat sink with thermal transfer properties and without the need for additional fasteners.

Thermal epoxy heat sink.

This thixotropic adhesive provides high temperature bonds to a variety of substrates. This range of high adhesion thin thermal tapes offers bonding strength and efficient heat dissipation for applications such as heat sink mounting and led lighting thermal management. 50 3186 nc is a perfect choice for applications requiring high thermal conductivity low thermal expansion and high operating temperature performance. The 70 3812nc aluminum filled epoxy adhesive has been specifically designed for bonding heat sinks that require high thermal conductivity and strong structural bonds.

One part oven cured epoxy system with excellent thermal conductivity and superb resistance to thermal cycling. One and two component thermally conductive epoxy and silicone compounds are employed for bonding heat sinks to electronics components and circuit boards to dissipate heat. In addition to providing strong bonds and thermal conductivity the 70 3812nc passes nasa s outgassing requirements per astm e 595 07. The liqui bond product line also offers mild elastic properties which assist in relieving cte mismatches.

50 3186 nc is a two part thermally conductive epoxy adhesive. 3m thermal transfer tapes are available in a variety of thicknesses to meet your most challenging thermal applications. The viscosity of this material is ideal for bonded fin heat sink applications and pipe bonding in extruded aluminum base applications. These thermal tapes provide excellent long term reliability electrical insulation and flame retardant performance.

Serviceable from 4k to 400 f.