Thermal Interface Material

Thermal interface material tim is a material that is used to transfer heat between two substrates.

Thermal interface material.

Thermal interface materials tims are widely employed to manufacture the most critical parts in the heat dissipation system to cool and protect integrated circuit ic chips. As an industry leader in high performance cost effective thermal interface materials tims and technologies laird designs and manufactures thermal products including gap fillers and putties phase change materials thermal greases and thermally conductive insulator materials that meet the demands interface materials tims and technologies laird designs and. Honeywell tims are based on proprietary technologies of polymer matrices and thermally conductive fillers enabling them to handle challenging heat dissipation issues. Typically a tim is specific to materials dispensed in very thin bond lines and dispensed directly onto individual electronic components or between a heat spreader and a heat sink.

Thermal interface materials the dissipation of heat is the key to maintaining longevity and reliability of semiconductor and power devices. An integrated circuit and a heat dissipating device e g. Thermal interface materials tims are a category of products used to aid thermal conduction between mechanically mated surfaces such as a semiconductor device and a heat sink. Egraf hitherm thermal interface materials tims are designed for long life mission critical applications that have extreme heat cycles.

Hitherm tims are made of flexible graphite specifically engineered for demanding lighting computing and power electronics applications. Irvine california henkel today announced the expansion of its award winning thermal interface materials tims portfolio with the addition of a product developed to address the high power density challenges associated with new 5g telecom infrastructure and consumer mobility designs. Thermal interface materials are designed to help remove the heat generated by an electronic device to the ambient environment to ensure reliable operation of electronic hardware communication equipment and portable electronics. Thermal interface materials provide a thermal path between the heat source and heat sink.

And matayabas j thermal contact resistance of cured gel polymeric thermal interface material submitted to ieee transactions on components and packaging technology 2003. While the surfaces to be placed in contact may appear flat closer inspection will show imperfections such as tool marks warped or imperfectly flat surfaces surface.