Thermally Conductive Adhesive Walk

Thermal conductivity of a typical unfilled epoxy system has a very low value of 0 14 w m k.

Thermally conductive adhesive walk.

The type of filler concentration of particles their size and shape will determine the thermal. Bond ply provides for the decoupling of bonded materials with mismatched thermal coefficients of expansion. Use them to encase electronic assemblies for protection from dust chemicals moisture mechanical shock and vibration. 3m thermally conductive adhesive transfer tape 8810 is designed to provide a preferential heat transfer path between heat generating components and heat sinks or other cooling devices e g fans heat spreaders or heat pipes.

This key property can be increased by adding metallic or ceramic fillers to the adhesive formulation. The bond ply family of materials are thermally conductive and electrically isolating. 3m thermally conductive adhesive transfer tape 8810 1 1 2 in x 36 yds 6 case bulk. Thermal conductive adhesives are also used as encapsulants for temperature sensors for enclosures or reactors.

Rigid and wear resistant epoxies are the strongest of the potting compounds. Used to bond heat sinks for example their heat conductivity reduces thermal strain to prevent performance loss or failure of electronic components. Formulated to draw heat away from sensitive electronic components these potting compounds have higher thermal conductivity than standard potting compounds. A replacement to heat cure adhesives.

Bond ply is available in a psa or laminating format. Formulating thermally conductive compounds. High mechanical strengthimproved surface wet out for rough surface lse substratesexcellent shock performancewider and longer roll is availablehalogen freeideal for thin bonding applicationsgood thermal transfer 3m thermally conductive adhesive transfer.