Tin Plating Solution

The tin plating solution consists of metal fluoborates addition agents stabilization additives and proprietary wetting agents in ready to use form.

Tin plating solution.

Leave it for between 30 seconds and 2 minutes to get a nice flat even layer of tin. Our tin plating processes facilitate soldering and improve anti galling properties in steel brass copper plus numerous other substrates which otherwise have poor solderability. Additionally this material offers an affordable finish electric conductivity and excellent corrosion protection. Ast provides a bright acid tin plating compliant to mil t 10727 type i and astm b 545.

Tin plating services tin plating specifications. Simply stick the pcb in a clean photographic tray or some other tray ideally with a pouring spout like this one and pour over the plating solution so the board is covered fully swish it back a forth a little. Excellent solderability and wire plating. The two most common tin plating services certified by advanced plating technologies are mil t 10727 astm b545 and ams 2408.

Electrolytic tin plating baths can be comprised of acid tin alkaline tin or methyl sulphonic acid solutions. Tin plating considered non toxic and non carcinogenic tin plating is a typical material used in engineering communications and consumer products for example. A plating bath includes tin that is dissolved to form positively charged ions that are suspended in the solution as well as other chemical additives. Quaker chemical offers a wide variety of products using the latest technology in the packaging industry to apply to your tin plating process.

The bath serves as the conductive medium during electrodeposition. The solution affords a high degree of uniformity and fine grain structure with a minimum of operational control. Our company can also certify tin plating services to iso 2093 as well as most company specific tin plating specifications. You will see an instant reaction with a fresh solution so don t hang around.